Pressurization conductive film for semiconductor package test (FM type)

Excellent for high frequency transmission.

We have small pitch types.

Excellent durability even when used with high current. 

Excellent cost performance.

Will not damage packages(Au pads, solder balls, and solder print bumps).

Maintenance-free. Easy, one-touch replacement.


 

Applications

IC package testing such as BGA, LGA, QFP, and QFN.

 

FM.BMP

 

Specifications

Pitch ≧0.3mm
Electrode size >Φ0.2mm
Sheet size max.200×200mm
Thickness 0.5~2.0 
Conducting direction

Perpendicular

Contact resistance  ≦50mΩ (value depends on sheet thickness)
Operating temperature

-45~125℃ 

Contact pressure 20~35g/ball (value depends on pitch)
Life cycle Around 80,000 touchdowns

 

 

 

※Specifications are subject to change without notice.


 




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