Horseshoe-shaped Mino Pin Test Socket

 

General Information

・Device application: high frequency, analog, power

Package application: QFN, DFN, QFP, SOP

Self-cleaning function with rolling contact design

Stable contact resistance

・Low initial failure rate

・Excellent electrical specification

・Long life cycle MTBA (Mean Time between Assists)

・Simple and easy maintenance

・Minimization of test cost

Rolling.jpg

 

Pin types

―Matt tin plating type: high contact force and self cleaning fuction

―Nickel, palladium gold plated type: low contact force (for preventing abrasion)

―Temperature: -40~+200℃

Upper-Elastomers-2.png

 

Prevents pad abrasion

・Damage to PCB pads is minimized by the rolling movement of pins when contacting the pads.

“SET”: with no contact force

“TEST”: with contact force

Light-Abrasion-Of-PCB-Contact-Pad.jpg

 

・After 1 million insertions, the mark/scratch size is merely 0.008mm.

Loadboard-Pad-Condition-2.jpg


Test socket structure

馬蹄型MINO Pin テストソケット-Structure-3.jpg

 

 

Specifications of the Mino Pin


 
MINO220  MINO250  MINO110
Element type MINO220.jpg
MINO250.jpg
MINO110.jpg
Contact Length
2.53mm 1.73mm 1.30mm
Insertion loss -1dB@22GHz -1dB@28GHz -1dB@35GHz
Return loss
 -20dB@7.5GHz -20dB@11.5GHz -20dB@14GHz
Inductance
0.45nH 0.36nH 0.28nH

Capaciance

0.23pF

0.19pF

0.16pF

Resistance
 <30mΩ <30mΩ <30mΩ
Environmental  -40℃~200℃ -40℃~200℃  -40℃~200℃
Contact Wipe 0.17mm 0.17mm 0.13mm
Travel
0.20mm 0.20mm 0.15mm
Contact Force 35g 35g 40g
Current 4A 3.5A 3A
Package Lead Pitch
≧0.35mm 0.35mm 0.35mm


 

Grounding specification

・Holding module: suitable for QFN and QFP test sockets. Excellent yield rate.

 

GND-MODULE-2.jpg GND-MODULE-1.jpg

 

・ Holding block: suitable for test sockets for package size under 3mm. Smooth and stable contact.

 

GND-BLOCK-2.jpg GND-BLOCK.jpg

 

 

 

 

 

※Specifications are subject to change without notice.



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