TPSPCR Semiconductor Test PCR (RF >70GHz)

Highslide JS

TPSPCR Semiconductor Test PCR (RF >70GHz)

Metal particle contacts are arranged in silicon rubber. Suitable for semiconductor test of gold-plated flat pads such as QFN and LGA.

  • Excellent RF performance. Can be used at >70GHz.
  • Fine pitch, as small as 0.1mm.
  • Stable contact resistance with average resistance of 20mΩ.
  • Wide temperature range (-50～＋180℃). Can be used for burn-in tests.
  • High current use of 0.25 to 40A
  • Standard sheet size of 26 x 26 mm. Please contact us for custom sizes.

Structure

Highslide JS
Anisotropic conductive rubber with metal particle contacts arranged in silicon rubber. Multiple metal particles contact the pad and electrically connected.

Main Specifications

Adaptive Frequency > 70GHz
Operating Temperature -50 to +180℃
Typical Resistance 20 mΩ
Current Rating (per minimum pad area) 0.25 to 40 A
Contact Pressure (per minimum pad area) 0.5 to 80 g / PAD
Standard sheet size 26×26mm

Detailed Specifications

Please select the product according to the dimensions of the device to be tested.

Highslide JS

Pad height includes the total height of opposing pads.

Highslide JS
Order code Pitch
(mm)		 Gap *1
(mm)		 Minimum pad area *2
(mm2)		  Minimum pad height *3
(mm)		 Sheet thickness
 (mm)		  Current Rating *4
(A)
TPSPCR-127 1.27 0.51 0.46 0.071 0.38 40
TPSPCR-100 1.00 0.40 0.28 0.071 0.25 20
TPSPCR-080 0.80 0.32 0.18 0.053 0.22 15
TPSPCR-065 0.65 0.26 0.12 0.053 0.17 12
TPSPCR-050 0.50 0.20 0.071 0.036 0.14 8.0
TPSPCR-040 0.40 0.16 0.045 0.036 0.11 6.0
TPSPCR-030 0.30 0.12 0.025 0.027 0.09 2.0
TPSPCR-020 0.20 0.08 0.011 0.018 0.06 1.0
TPSPCR-010 0.10 0.04 0.0028 0.018 0.05 0.25

 

* 1 – 3) Pitch, Gap, and Minimum Pad Area values represent the dimensions required for your DUT pad.
* 1) Gap represents the dimension required for the distance between the pad surfaces of the DUT.
* 2) Pad area is the projected inter-connecting area between opposing pads.  For example, if you sandwich the TPSPCR between PCB pad and DUT pad, it refers to the common area in which both the PCB pad and the DUT pad are contacting the TPSPCR.
* 3 ) Pad height includes the total height of opposing pads.

* 4) Contact area: Per minimum pad area.

 

 

* Specifications are subject to change without notice.