FM type Pressurization conductive film for semiconductor package test
FM type Pressurization conductive film for semiconductor package test
A full custom solution – creating contact points in accordance with the pad position of the chip.
Suitable for semiconductor test such as BGA, LGA, QFP, QFN.
- Excellent in RF transmission
- Fine pitch
- Excellent cost performance
- Does not damage packages (gold pad, solder ball, solder printing bump).
- Easy maintenance / one-touch replacement.
Applications
IC package testing such as BGA, LGA, QFP, and QFN
Main Specifications
| Adaptive Frequency | 40 GHz (for thickness 0.8mm) |
| Pitch | ≧ 0.3 mm |
| Electrode size | ＞Φ0.2 mm |
| Sheet size | Max. 200 × 200mm |
| Thickness | 0.5 ～ 2.0 |
| Conduction direction | Perpendicular |
| Contact resistance | ≤50 mΩ (value depends on sheet thickness) |
| Operating temperature | -45 ～ 125℃ |
| Contact pressure | 20 – 35 g / ball (value depends on pitch) |
| life cycle | 80,000 touchdowns |
* Specifications are subject to change without notice.